TSMC Scrutinizes US Infrastructure Amid $64B Expansion Plan

TSMC is sending personnel to evaluate the status of US datacenter construction and power availability, according to reporting from The Register. The move comes as the Taiwanese chipmaking giant plans to expand capacity to meet AI demand that continues to outstrip supply.

During a third-quarter earnings call, TSMC Chairman and CEO C.C. Wei stated that the company expects capital expenditure to reach between $60 billion and $64 billion this year. Wei noted that spending from 2026 to 2028 is projected to exceed the total spent between 2023 and 2025. While TSMC is planning approximately 20 leading-edge manufacturing and advanced-packaging facilities globally over the next several years, the company is verifying that the necessary infrastructure—including power, networking, and memory—is in place before further committing to capacity increases.

When questioned by an analyst regarding whether growth could be hindered by power shortages, limited high-bandwidth memory (HBM) supplies, advanced-packaging constraints, or datacenter construction delays, Wei stated that TSMC incorporates these factors into its planning. He noted that the company assesses cloud service provider capex and power supply to make judgments on demand, which he maintains remains higher than supply.

Despite the expansion, Wei warned that macroeconomic uncertainties and rising component prices are challenging consumer and price-sensitive market segments. Financially, TSMC reported revenue of $46.72 billion for the third quarter ended September 30, 2026, and projects fourth-quarter revenue between $52.3 billion and $54.3 billion.